I-BOND TOTAL ETCH VALUE PACK (3/PK) PATTERSON Hand instrument-Pliers to grasp and

Hand instrument-Pliers to grasp and transfer materials in and out of oral cavity

minimal polymerization shrinkage and extremely low solubility

VPS impression material for 1-step and 2-step putty/wash techniques

This system operates using SmartMode™ Technology

I-BOND TOTAL ETCH VALUE PACK (3/PK) PATTERSON Hand instrument-Pliers to grasp andiBOND Total Etch is an Etch & Rinse 2 step bonding system from Heraeus. Due to the innovative nano filler technology, iBOND Total Etch not only attains high bond strengths to both enamel and dentin, but also ensures optimal marginal adaptation and is ideal for desensitizing hypersensitive areas. Bonding of direct composite restorations Bonding of indirect restorations Treatment of hypersensitive tooth areas